TSMC, Samsung Adopt ASML's $400M AI Chip Machines

TSMC, Samsung Adopt ASML's $400M AI Chip Machines

Two technicians in cleanroom gear converse near semiconductor manufacturing machinery
Cleanroom technicians at a semiconductor fabrication facility where TSMC and Samsung deploy ASML's advanced chip-making machinesIllustration: The Frank

The News

TSMC and Samsung, the world's two biggest chipmakers, have committed to using ASML's next-generation High NA extreme ultraviolet lithography machines, the Dutch toolmaker said Tuesday, as demand for AI chips drives the industry toward smaller and more complex designs.

The machines cost around $400 million each, according to CNBC, and print the circuit patterns onto silicon wafers that make a chip a chip.

The two companies join Intel, which ASML said in July is already using High NA tools for advanced chip manufacturing.

The Second Announcement

TSMC and Samsung are also joining ASML in an industry effort to move photomasks — the stencils used to print patterns onto wafers — from today's 6-inch format up to 12 inches. ASML says the bigger masks mean better productivity and lower chipmaking costs.

That matters because High NA tools currently print with a smaller mask, which caps how physically large a chip they can make. ASML's existing EUV tools can print a chip up to about 800 square millimeters, and Nvidia, Google and others design data center chips right up to that limit, Reuters reported.

Timeline

July 15, 2026

Reuters reports Intel is turning to ASML's next-generation tool to help make its laptop chips. ASML said in July that Intel is using High NA EUV technology for advanced chip manufacturing.

Sept. 8, 2026

ASML announces commitments from TSMC and Samsung to use its High NA EUV machines, plus a broader industry agreement on 12-inch photomasks. Bloomberg reported Intel is also backing the 12-inch mask effort.

Same day

SK Hynix says it is evaluating joining the 12-inch mask consortium and is targeting 2028 to apply High NA EUV processes to DRAM mass production, according to Reuters.

2027

ASML has said it will add about 30% total EUV capacity.

Reactions

TSMC said it will use ASML's tools for advanced chips and expects use of High NA machines to rise, "driven primarily by the increasingly complex transistor architectures required for AI applications."

Samsung said adopting the technology would "extend the DRAM scaling roadmap" and make its process more efficient.

Barclays called the announcements "a positive" in a note Tuesday, saying they "should provide more visibility on adoption which has been a key debate." The bank added: "We see ASML with a significant decision ahead on whether to further expand EUV capacity than the recently expanded targets it has already given. Demand is clearly strong."

Investors were unmoved on the day — Amsterdam-listed ASML shares traded flat-to-lower in early Tuesday trading, after a roughly 120% run over the last year.

What's Next

ASML has not given a recent forecast for how many High NA machines it expects to sell, and Barclays says the company now faces a decision on whether to expand EUV capacity beyond its already-raised targets.

The High NA machines are in production use at Intel but are not yet running high-volume work at TSMC or Samsung, per Reuters — the move to larger masks is meant to change that.

SK Hynix's decision on joining the 12-inch mask consortium is still pending.

More

EUV lithography is the choke point of the modern chip industry. ASML is the only company in the world that builds these machines, which is why a single Dutch firm's customer list is a read on where AI computing goes next — and why Washington has treated ASML's export licenses as a national security matter.

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